WebTSSOP5_SOT353_mk. plastic, surface-mounted package; 5 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body. Marcom graphics. 2024-01-28. SOT353. 3D model for products with SOT353 package. Design support. Web24C128 Product details. Description. The AT24C128/256 provides 131,072/262,144 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 16,384/32,768 words of 8 bits each. The device’s cascadable feature allows up to 4 devices to share a common Two-wire bus. The device is optimized for use in many ...
TSSOP5 (SOT353) Nexperia
Web8-TSSOP Package Outline Drawing 4.4 mm Body 0.65mm Pitch PGG8D1, PSC-4768-01, Rev 00, Page 1. 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M … The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. See more The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. See more They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. See more • List of integrated circuit packaging types • Small outline integrated circuit See more • Soldering a TSSOP chip by hand See more Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will … See more • Shrink Small Outline Package • Mini Small Outline Package • Small outline integrated circuit See more how much of canada is uninhabited
TDA5200XUMA1 Infineon, RF Receiver, Alarm, Keyless Entry - Farnell
WebFeb 1, 2006 · Improved business unit margin by more than 5% in 14 months by right-sizing the line and managing customer/product mix. ... Job included designing TSSOP, SOIC and SSOP packages as well as developing and qualifying these new packages for multiple semiconductor companies. WebiC-Haus WebMM74HCT00MTCX TSSOP−14 WB, Case 948G (Pb−Free and Halide Free) 2500 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: All packages are lead free per JEDEC: J−STD−020B standard. how much of challenger was recovered